HEATKILLERŪ CPU Rev3.0 775 LC_nbsp_without Fittings
The HEATKILLERŪCPU Rev.3 sets a new benchmark in cooling performance, quality and user friendliness. The HEATKILLERŪ3.0 is the perfect choice for cooling of the modern CPU generations.
A central flow system paired with a nozzle array and an outstandingly fine cooling geometry result in the extreme cooling performance of the waterblock. The baseplate can geometrically adapt to the CPU Heatspreader and therefore ensures perfect contact with the CPU._nbsp_ The modular design allows easy opening of the HEATKILLERŪ, a change of sockets and mounting systems is possible at any time and easily done. Separately available mounting plates and spare parts ensure simple repairs and operation even in many years. The cooling geometry made from pure Copper and the upper part are made from_nbsp_POM, the mounting plate and applciations are made from sanded stainless steel._nbsp_
Technical Specifications
Material: Electrolytic Copper, POM, High-Grade SteelDimensions: LxBxH - 59x59x17.5 mmWeight: Approximately 150gO-ring Seal: EPDM 75 (max. 150°C)Connections: BSPP (G) 1/4_az_ Threads (ISO 228-1)Compatible with: Intel Socket 775
Extent of delivery:1x HEATKILLERŪ CPU_nbsp_775 Rev. 31x Installation material and manual
Manufacturer:_nbsp_Watercool e.K. Germany
HEATKILLERŪ CPU Rev3.0 775 LT_nbsp_without Fittings
A central flow system paired with a nozzle array and an outstandingly fine cooling geometry result in the extreme cooling performance of the waterblock. The baseplate can geometrically adapt to the CPU Heatspreader and therefore ensures perfect contact with the CPU. For use on a Quad core CPU the waterblock has an insertable distributor plate which directs the flow parallel to both DIEs. The modular design allows easy opening of the HEATKILLERŪ, a change of sockets and mounting systems is possible at any time and easily done. Separately available mounting plates and spare parts ensure simple repairs and operation even in many years. The cooling geometry is made from pure copper and the upper part are made from_nbsp_POM, the mounting plate and applciations are made from sanded stainless steel.
Extent of delivery:1x HEATKILLERŪ CPU_nbsp_775 Rev. 31x Installation material and manual 1x Distributor plate
HEATKILLERŪ CPU Rev3.0 775_nbsp_without Fittings
A central flow system paired with a nozzle array and an outstandingly fine cooling geometry result in the extreme cooling performance of the waterblock. The baseplate can geometrically adapt to the CPU Heatspreader and therefore ensures perfect contact with the CPU. For use on a Quad core CPU the waterblock has an insertable distributor plate which directs the flow parallel to both DIEs. The modular design allows easy opening of the HEATKILLERŪ, a change of sockets and mounting systems is possible at any time and easily done. Separately available mounting plates and spare parts ensure simple repairs and operation even in many years. The cooling geometry as well as the upper part are made from pure copper, the mounting plate and applciations are made from sanded stainless steel. To prevent tarnishing of the copper the upper parts are sealed with a special clear lacquer.
Material: Electrolytic Copper, High-Grade SteelDimensions: LxBxH - 59x59x17.5 mmWeight: Approximately 400gO-ring Seal: EPDM 75 (max. 150°C)Connections: BSPP (G) 1/4_az_ Threads (ISO 228-1)Compatible with: Intel Socket 775
HEATKILLERŪ Backplate LGA775
Universal Back Plate for Socket 775. The back plate has built M4 threaded mounting screws or the spacers in the back plate will be screwed. When the back plate coolers with version 2.6 or smaller, longer screws are needed.
Specifications: Material: Stainless Steel Compatibility: Socket_nbsp_LGA775
Delivery: 1x Back Plate_nbsp_LGA775_nbsp_